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Product Information

Specifications

SMM5849XZ


Part Number SMM5849XZ
Class Power GaAs > C to V Band Power Amplifier MMICs (Die)
Function 20-30GHz Power Amplifier MMIC
Features
  • Wafer Level Chip Size Package with Solder Ball
  • Associated Gain : Gas=26dB (typ.)
  • Output Third Order Intercept Point (OIP3) : +27dBm
  • Low Current Consumption : IDD=300mA
  • Impedance Matched Zin/ Zout = 50ohm
Description The SMM5849XZ is a Driver Amp MMIC for applications in the 20 to 30GHz frequency range. This product is well suited for satellite communications, radio link and wireless communications. The flip chip die can be used in solder reflow process. Sumitomo Electric's stringent Quality Assurance Program assures the highest reliability and consistent performance.
Datasheet ( PDF 655KB)

Frequency Range f (GHz) 20-30
Output Power at 1dB G.C.P.P1 db dBm (Typ.) 18
Gain at 1dB G.C.P.G1dB dB (Typ.) 29
3rd. Order Intercept Point OIP3 dBm (Typ.) 27
Drain-Source Voltage VDD(V) 3
IDD (DC) Typ. (mA) 300
Drain Current at 1dB G.C.P.lDD mA (Typ.) 320
Function / Application Power Amp. Radio Link
Note Ta=+25°C
Documents
ApplicationNote Reliability test report of mounting temperature cycling for WLCSP
(PDF 345KB)

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