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SEI/SEDI proposes the WLCSP (Wafer Level Chip Scale Package) technology for the solution of the next generation device.
This technology achieved a very excellent frequency performance by uniting with 3- D MMIC technology, and can apply from C to E-band applications.
The WLCSP chip is the flip chip form with the solder ball and it is mountable in the SMT production line.
It is unnecessary the wire bonding, it can achieve high mass productivity up to high frequency range.
Outline of WLCSP MMIC
SMM5139XZ
| 13/15GHz | 18/23GHz | 24/30GHz | |
|---|---|---|---|
| Low Noise Amp | SMM5722XZ | SMM5723XZ* | SMM5724XZ* |
| Down Converter | SMM5139XZ | SMM5142XZ* | SMM5144XZ* |
| Up Converter | SMM5138XZ | SMM5141XZ* | SMM5143XZ* |

V1D PackageTa=+25°C
| Part Number | Frequency Range f(GHz) |
Output Power at 1dB G.C.P. P1dB dBm (Typ.) |
Gain at 1dB G.C.P. G1dB dB (Typ.) |
3rd. Order Intercept Point OIP3 dBm (Typ.) |
Drain-Source Voltage VDD (V) |
Drain Current at 1dB G.C.P. lDD mA (Typ.) |
Outline/ Package Code |
|---|---|---|---|---|---|---|---|
| SMM5085V1B | 12.7-15.4 | 32.5 | 24 | 42 | 6 | 1500 | V1B |
| EMM5081V1B | 13.75-14.5 | 33.5 | 29 | 39.5 | 6 | 1400 | |
| EMM5836V1B/001 | 17.7-19.7 | 32.5 | 22 | 40 | 6 | 1800 | |
| SMM5845V1B | 21.2-23.6 | 33 | 21 | 41 | 6 | 1800 | |
| SMM5846V1D | 27.5-29.5 | 31 | 19 | 39 | 6 | 1450 | V1D |
| EMM5841V1B | 29.5-30.0 | 30 | 14 | - | 6 | 850 | V1B |
G.C.P. : Gain Compression Point
| (C) 2007 Sumitomo Electric Industries, Ltd. |
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