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Product Information

Specifications

SMM5150XZ


Part Number SMM5150XZ
Class Power GaAs > Ku to Ka Band Converter MMICs
Outline / Package Code WLCSP
Function 24-30GHz Up converter MMIC
Features
  • Wafer Level Chip Size Package with Solder Ball
  • Integrated Image Rejection Mixer, LO Buffer Amplifier and x2 multiplier
  • Conversion Gain : -13dB
  • Input Third Order Intercept Point (IIP3) : +22dBm
  • Image Rejection : 20dB
  • 2LO-RF Isolation : 25dB
  • 0dBm LO Drive Level
Description The SMM5150XZ is a image-rejection up converter MMIC for applications in the 24 to 30GHz frequency range. The device consists of a image rejection resistive PHEMT mixer, LO buffer amplifier and x2 multiplier in a flip chip form. The flip chip die can be used in solder reflow process. Sumitomo Electric's stringent Quality Assurance Program assures the highest reliability and consistent performance.
Datasheet ( PDF 786KB)

RF Frequency f (GHz) 24-30
IF Frequency f (GHz) DC-4
Conversion Gain (dB) -13
3rd. Order Input Intercept Point IIP3 dBm 22
LO-RF Isolation (dB) 25
Drain-Source Voltage VDD (V) 5
IDD (DC) Typ. (mA) 100
Current Consumption (mA) 100
Function with Doubler, Image-rejection Up Converter
Note Tc=+25°C
Documents
ApplicationNote Reliability test report of mounting temperature cycling for WLCSP
(PDF 345KB)

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