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Product Information

Specifications

SMM5724XZ


Part Number SMM5724XZ
Status Under Development
Class Power GaAs > Ku to V Band Low Noise Amplifier MMICs
Outline / Package Code WLCSP
Function 24-30GHz Low Noise/ Driver Amplifier MMIC
Features
  • Wafer Level Chip Scale Package with Solder Ball
  • Low Noise Figure : NF=3.2dB (typ.)
  • High Associated Gain : Gas=22dB (typ.)
  • Input Third Order Intercept Point (IIP3) : +4dBm
  • Impedance Matched Zin/ Zout = 50Ω
Description The ES/SMM5724XZ is a Low Noise/ Driver Amplifier MMIC for applications in the 24 to 30GHz frequency range. This product is well suited for satellite communications, radio link and wireless communications where low noise characteristics is required. The flip chip die can be used in solder reflow process. Sumitomo Electric's stringent Quality Assurance Program assures the highest reliability and consistent performance.
Datasheet ( PDF 693KB)

Frequency Range f (GHz) 24-30
Output Power at 1dB G.C.P. P1dB dBm (Typ.) 13
Associated Gain Gas dB (Typ.) 20
3rd. Order Intercept Point IIP3 dBm (Typ.) 4
Noise Figure NF dB (Typ.) 3.2
Drain-Source Voltage VDD (V) 5
IDD (DC) Typ. (mA) 80
Drain Current lDD mA (Typ.) 80
Application VSAT and Radio Link
Note Tc=+25°C
Documents
ApplicationNote Reliability test report of mounting temperature cycling for WLCSP
(PDF 345KB)

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